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PHY Heatsink
The PHY Heatsink is an expertly designed extruded aluminum heat sink, optimized for efficient thermal management. Ideal for high-power electronics, its durable aluminum construction ensures excellent heat dissipation and longevity. Featuring a sleek and compact profile, it’s suited for a wide range of industrial applications, offering reliable performance and easy installation.INQUIRE NOW
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BGA Heatsink
This BGA extrusion heat sink is crafted from high-quality aluminum with a black anodized finish for optimal heat dissipation. Its vertical fin structure maximizes airflow and surface area, making it ideal for compact electronics. Lightweight yet durable, it ensures reliable cooling for BGA components, enhancing performance and longevity.INQUIRE NOW
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Led Light Heatsink
This LED light heat sink is made of premium aluminum with a black anodized finish for efficient thermal management. Its radial fin design optimizes airflow and heat dissipation, making it perfect for cooling high-power LED lighting solutions. The lightweight yet durable structure ensures consistent performance and helps extend the lifespan of LED components by preventing overheating. Ideal for applications requiring compact, effective cooling for LED lights.INQUIRE NOW
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Bridge Chips Heatsink
This bridge chip heat sink is constructed from high-quality aluminum with a black anodized finish for superior thermal management. Designed for efficient cooling, it features multiple vertical fins that enhance heat dissipation and airflow. The mounting tabs make installation easy and secure. Ideal for bridge chips and other critical components, this heat sink ensures stable performance and longevity of your devices by effectively preventing overheating. Perfect for use in compact electronic systems requiring robust cooling solutions.INQUIRE NOW
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BGA Heatsink
This BGA heat sink is constructed from high-quality aluminum with a black anodized finish for efficient thermal conductivity. Its compact design with vertical fins maximizes heat dissipation while keeping the overall weight low. Ideal for Ball Grid Array (BGA) applications, it ensures stable temperatures and extends component life by preventing overheating. The lightweight yet robust construction makes it a reliable solution for various compact electronic assemblies requiring effective heat management.INQUIRE NOW
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BGA Heatsink
This BGA heat sink features high-quality aluminum construction in a natural finish for effective heat dissipation. Its vertical fin design maximizes airflow, ensuring efficient thermal management for Ball Grid Array (BGA) components. Ideal for compact electronics, it offers durable, lightweight cooling to maintain stable temperatures and extend component life. The heat sink's precision-extruded design is perfect for enhancing performance in high-power BGA applications, providing reliable cooling and optimal efficiency.INQUIRE NOW
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