Engineering, research and development services

Engineering, research and development services

The failure rate of electronic components increases exponentially with the rise of working temperature, and the increase of working frequency leads to the increase of surface heat flux and the rapid rise of working temperature, which directly threatens the operating stability and safety of electronic components. In order to meet the heat dissipation needs of different electronic components and achieve efficient cooling of multi-chip modules, our company focuses on developing heat dissipation products of high comprehensive performance according to customers' requirements.