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High Power Heat Pipe Heat Sink
Designed to manage high thermal loads, this heat sink features multiple heat pipes and an efficient fin structure to maximize heat dissipation. The heat pipes rapidly transfer heat away from the source to the fins, where it is effectively dissipated into the surrounding air. With its robust construction, this cooling solution is ideal for demanding applications such as high-performance CPUs, GPUs, and power electronics, ensuring optimal temperature control and enhancing the reliability and lifespan of the devices. -
CAGE CFP2 100G DCO Heat Sink
The CAGE CFP2 100G DCO Heat Sink features advanced heatpipe cooling technology, designed for high-density data centers and telecom infrastructure. Its high-quality aluminum construction ensures efficient thermal conductivity, extending device lifespan. Suitable for CFP2 modules, it guarantees stability and reliability for 100G DCO applications. -
5G Base Station Cooling
This advanced heat sink is designed for efficient cooling in 5G base stations, utilizing heatpipe cooling technology to ensure optimal thermal management. With its high-performance aluminum construction, it rapidly dissipates heat, ensuring the stable operation of critical components in high-density, high-temperature environments. Ideal for demanding 5G infrastructure applications, this heat sink enhances system reliability and extends component lifespan. -
Heatsinks With Heatpipes
This heatsink integrates advanced heatpipe cooling technology, designed to efficiently manage high thermal loads. The copper heatpipes quickly transfer heat away from critical components, ensuring stable performance in demanding environments. Perfect for applications in electronics, telecom, and industrial equipment, this heatsink is engineered for reliability and long-lasting cooling efficiency. -
500 Watt Communication Heat Sink
The 500W Communication Heat Sink with heatpipe cooling technology offers superior thermal management for high-power communication devices. It features copper heatpipes and aluminum fins for efficient heat dissipation, ensuring stable operation and extended device lifespan in demanding environments. -
LM2-200GbMXP CFP2 Heat Sink
The LM2-200GbMXP CFP2 Heat Sink with heatpipe cooling ensures high-efficiency thermal management for high-speed communication modules. Its copper heatpipes and aluminum structure offer superior heat dissipation, maintaining stable performance for 200Gbps systems. Ideal for demanding network environments.
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