Heat Sink Engineering | Custom Thermal Solutions

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Engineering, research and development services

The failure rate of electronic components increases exponentially with the rise of working
temperature, and the increase of working frequency leads to the increase of surface heat
flux and the rapid rise of working temperature, which directly threatens the operating
stability and safety of electronic components. In order to meet the heat dissipation needs
of different electronic components and achieve efficient cooling of multi-chip modules, our
company focuses on developing heat dissipation products of high comprehensive performance
according to customers' requirements.
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Provide heat dissipation demand
We provide heat dissipation designs
Test samples
Finalize the design
Manufacture products

START

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Applied to server boards

Application

Technical

Completed

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Applied to military power amplifiers

Application

Technical

Completed

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Continuous updates

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Technological Process

Cutting

02
CNC machining center

04
Wire drawing

06
Heat pipe manufacturing

08
Soldering

10
Radium carving

12
Quality sampling

14

Extrusion

01
stamping

03
Turning and milling

05
surface treatment

07
vapor Chamber manufacturing

09
screen printing

11
Assembly

13
Packaging

15

If our product is what you want

Please get in touch with our team immediately to answer you with a more professional solution