More than 3000 tons of stamping machines,
we can turn tooling charge after large quantities.
Cost-efficient stamped heat sinks enhance heat transfer for circuit board components by increasing surface area. These heat sinks are punched out through detail adding progressive procedures that impart details to sheet metal at each stamp. Specific electronic package types are accommodated through the design of the stamped heat sinks for ideal fitting and functionality. Mounting options are diverse, ranging from integration with solder tabs and pins to slide-on parts and through-hole hardware like nuts and screws. Many of these heat sinks feature finishes boost their natural convection radiation and thermal capabilities.
Through stamping, intricate geometries are formed from sheet metal in the creation of heat dissipation surfaces and enclosures. Our in-house progressive stamping processes produce heat sinks for use with board-level devices and complement these with zipper fin stack requirements.
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