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BGA Chipest W50*H10mm
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BGA Chipest W50*H10mm

  • Enner Part Number

    EAF-0111-SXW

  • Manufacturer

    Enner Technology Co.,LTD

  • Main process

    Extrusion

  • Description

    HEATSINK AL6063

  • Manufacturer standard Lead Time

    2~3 Weeks

  • RoHs status

    RoHS Compliant
  • Enner Part NumberEAF-0111-SXW
  • ManufacturerEnner Technology Co.,LTD
  • Main process Extrusion
  • DescriptionHEATSINK AL6063
  • Manufacturer standard Lead Time2~3 Weeks
  • RoHs statusRoHS Compliant

  • Details

  • Contact

Product Details

Shape

Rectangle

Length

38.00 mm

Width

50.00 mm

　

Height

10.00 mm

　

Diameter

-

Fin thickness 

1.20 mm

Material

6063 T5

Alloy or not 

Yes

Serface treatment

Conversion coating

Model No.

EAF-0111-SXW

Application

For BGA

 

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